Butterfly Network, Inc. Appoints David Horsley as SVP, Innovation – Butterfly Embedded™

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David Horsley

Butterfly Network, Inc. Appoints David Horsley as SVP, Innovation – Butterfly Embedded™
Butterfly Network, Inc. Appoints David Horsley as SVP, Innovation – Butterfly Embedded™

Butterfly Network, Inc., a leader in semiconductor-based ultrasound devices, cloud software, and AI, has appointed David Horsley, Ph.D., as Senior Vice President of Innovation – Butterfly Embedded™. 

In this role, he will lead strategy, product development, partnerships, and commercialization efforts to scale the company’s Ultrasound-on-Chip™ co-development and licensing initiative.

Butterfly Embedded is designed to expand the reach of Butterfly’s proprietary semiconductor ultrasound platform through co-development, licensing, and strategic collaborations. The initiative enables partners to integrate Butterfly’s core ultrasound technology into a wide range of new products and applications, extending its use beyond traditional point-of-care settings.

Dr. Horsley brings extensive academic and industry experience in semiconductor innovation and advanced sensor technologies. He currently serves as Professor of Electrical and Computer Engineering and Co-Director of the Institute for NanoSystems Innovation at Northeastern University, and as Adjunct Professor of Mechanical Engineering at University of California, Berkeley. He is also a Fellow of both IEEE and the National Academy of Inventors.

Previously, Dr. Horsley served as Chief Technology Officer of the Emerging Sensors Business Unit at TDK InvenSense and co-founded Chirp Microsystems, later acquired by TDK. He has also held leadership roles at Hewlett Packard Laboratories and Onix Microsystems, contributing to the commercialization of MEMS and ultrasound technologies.